Nordson Dage 4600 Wire Bondtester

Nordson Dage 4600 Wire Bondtester

Model: 4600 Mainframe Automated Bondtester

Like New, Used in Lab less than 50 hours!

DOM: 05/2019

Installed: 03/2020

Precision shear and pull tests on semiconductor and microelectronic devices

On-board cameras for auto-focus

Manual and Dual Camera-assist Automation

Force Range: Capable of applying forces ranging from 0.01 gf - 50 kgf.

Step back accuracy (force dependent): +/- 0.25μm

System accuracy (force dependent): +/- 0.10% - 0.05 % FSL 

Axis travel: 450 mm x 410 mm x 75 mm

XY speed and resolution: Up to 70 mm/s, 100 nm

Z speed resolution: 5 mm/s, 250 nm

Included: Manual, Spare Parts

Fully Functional