Nordson Yestech FX-940 3D AOI System

Nordson Yestech FX-940 3D AOI System

Automated Optical Inspection System

3D Inspection

DOM: 03/2018

Multi-function system with top-down viewing,

Capture on the fly technology

Digital Fringe Projection 3D Inspection

Throughput: Up to 30 sq. in./sec. > 1.5 million components per hour

Maximum Board Size: 20” x 21” (500mm x 525mm)

Clearance: 2” (50mm) top and bottom

Minimum Component Size: 0201; 01005 with high magnification option

False Calls: <500 PPM (<0.05% typical)

Defects Detected: Part: position, missing, wrong, polarity, skew, tombstone

Lead: bent, lifted, bridging

Solder: open, insufficient, short, solder balls

3D Inspection

Proprietary megapixel color imaging

Capture on the fly technology

Quick set-up

High speed

High defect coverage / low false failure

Automated Inspection for:

Solder defects

Lead defects / lifted leads

Component presence and position

Correct part / polarity

Through-hole parts

Co-planarity of chips, BGAs and other height sensitive devices

Power: 110-220VAC, 50/60 Hz, 15 amps

Air input: 60 PSI min., 1/4” air hose, 2 CFM

Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)

Weight: 1050 lbs (430 kg)