BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder
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BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder
Available quantity:1
orCall 833-768-8733 (Toll Free)
Description
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder
High accuracy and high productivity
DOM: 2019
Less than 100 operating hours...VERY LOW USE!
Wafer Table
Tool Changer Unit 7 Slots
Main – Musashi Super Sigma V2
Internal Vacuum Pump
P-part at Main AXIS
Microscope
12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4")
2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT)
4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT)
2" GP-Adapter - (12"-FF123) - 22 up - (any WT)
4" GP-Adapter - 12" (FF123) - 7 up - (std WT)
Available Jan/Feb 2023
Specifications
Manufacturer | DATACON |
Model | 2200 EVO |
Year | 2019 |
Condition | Used |